Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics
نویسندگان
چکیده
منابع مشابه
Quantitative Accelerated Life Testing of MEMS Accelerometers
Quantitative Accelerated Life Testing (QALT) is a solution for assessing thereliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shownin this paper and an attempt to assess the reliability level for a batch of MEMSaccelerometers is reported. The testing plan is application-driven and contains combinedtests: thermal (high temperature) and mechanical stress. Two variant...
متن کاملFracture mechanics-based life prediction of a riveted lap joint
In this paper, three-dimensional modeling of the fatigue crack growth profiles was performed in a simple riveted lap joint. Simulation results showed that mode I was dominated on the one side of the plates and the crack straightly grew on this side, while the other side of the plates was in a mixed-mode condition and the crack propagation path was not straight on this side. Afterward, the fract...
متن کاملDesign of Accelerated Life Testing Plans for Products Exposed to Random Usage
< p>Accelerated Life Testing (ALT) is very important in evaluating the reliability of highly reliable products. According to ALT procedure, products undergo higher stress levels than normal conditions to reduce the failure times. ALTs have been studied for various conditions and stresses. In addition to common stress such as temperature and humidity, random usage can also be considered as anoth...
متن کاملBayesian Accelerated Life Testing
In this paper a Bayesian approach for accelerated life testing will be considered. It will be assumed that the failure times at the different stress levels follow a Weibull distribution and exponential distribution, respectively. In accelerated life tests, the components are exposed to an environment that is more severe that the usual environment, such that the components will fail in a shorter...
متن کاملEnvironmental Stress Testing of Power Transistors Encapsulated in Plastic Packages
Power HEXFET transistors encapsulated in TO-220-style and SOT223-style plastic packages were subjected to preconditioning per the JEDEC JESD22-A113 standard, which includes solder reflow simulation and flux application, and to environmental stress testing: highly accelerated biased temperature and humidity test (HAST) and multiple temperature cycling. Electrical measurements and C-SAM mode acou...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Microelectronics Reliability
سال: 2018
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2017.10.022